Superconducting routing platform for large-scale integration of quantum technologies
Résumé
To reach large-scale quantum computing, three-dimensional integration of scalable qubit arrays
and their control electronics in multi-chip assemblies is promising. Within these assemblies, the
use of superconducting interconnections, as routing layers, offers interesting perspectives in terms
of (1) thermal management to protect the qubits from control electronics self-heating, (2) passive
device performance with significant increase of quality factors and (3) density rise of low and high
frequency signals thanks to minimal dispersion. We report on the fabrication, using 200 mm silicon
wafer technologies, of a multi-layer routing platform designed for the hybridization of spin qubit
and control electronics chips. A routing level couples the qubits and the control circuits through
one layer of Al0.995Cu0.005 and superconducting layers of TiN, Nb or NbN, connected between them
by W-based vias. Wafer-level parametric tests at 300 K validate the yield of these technologies while
low temperature electrical measurements in cryostat are used to extract the superconducting
properties of the routing layers. Preliminary low temperature radio-frequency characterizations of
superconducting passive elements, embedded in these routing levels, are presented.
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Thomas_2022_Mater._Quantum_Technol._2_035001 (1).pdf (1.38 Mo)
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MQTac88aesupp1.pdf (1.21 Mo)
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