Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs - Archive ouverte HAL Access content directly
Conference Papers Year : 2023
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hal-04166906 , version 1 (20-07-2023)

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  • HAL Id : hal-04166906 , version 1

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Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont. Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs. IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Dresden, IEEE Electron Devices Society, May 2023, Dresden, Germany. ⟨hal-04166906⟩
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