Conference Papers
Year : 2023
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https://hal.science/hal-04166906
Submitted on : Thursday, July 20, 2023-11:57:31 AM
Last modification on : Saturday, November 11, 2023-3:32:45 AM
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- HAL Id : hal-04166906 , version 1
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Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont. Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs. IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Dresden, IEEE Electron Devices Society, May 2023, Dresden, Germany. ⟨hal-04166906⟩
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