Post‐curing and structural relaxation of epoxy networks during early stages of aging for civil engineering applications - Archive ouverte HAL
Article Dans Une Revue Applied Research Année : 2023

Post‐curing and structural relaxation of epoxy networks during early stages of aging for civil engineering applications

Résumé

In this work, epoxy networks used for civil engineering constructions are aged at ambient temperature, and the impact of the early stages of aging on mechanical properties is analyzed. It is observed that Young's modulus and the yield stress increase with the aging time whereas the strain at break and the toughness decrease. The structural causes for these variations are investigated by swelling experiments, infrared spectroscopy, thermogravimetric analysis, differential scanning calorimetry, and dynamic mechanical analysis. By combining experimental results, it is deduced that the aging process occurs in two stages. During the first 7 days of aging, the change in mechanical properties should essentially be attributed to the postcuring, which results in additional crosslinking reactions. When increasing the aging time to 21 days, the crosslinking density reaches a plateau, but a second stage emerges, in which the mechanical properties continue evolving in the same way, with variations of the mechanical parameters being of comparable amplitude. This second stage is attributed to the evolution of the thermodynamic state of the glass, leading to a densification of the epoxy network through minimization of the free volume, and favoring the creation of physical interactions between polymer segments. Therefore, structural relaxation is shown to have a significant impact on the mechanical properties.
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Dates et versions

hal-04042345 , version 1 (23-03-2023)

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Sanaa Oumnas, Blandine Quelennec, Emmanuel Richaud, Alexis Duthoit, Nicolas Delpouve, et al.. Post‐curing and structural relaxation of epoxy networks during early stages of aging for civil engineering applications. Applied Research, 2023, ⟨10.1002/appl.202200090⟩. ⟨hal-04042345⟩
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