Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction - Archive ouverte HAL Accéder directement au contenu
Poster De Conférence Année : 2022

Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction

Fichier non déposé

Dates et versions

hal-03962880 , version 1 (30-01-2023)

Identifiants

  • HAL Id : hal-03962880 , version 1

Citer

Bassel Ayoub, Faycal Houssaini, Stephane Moreau, Sandrine Lhostis, Thomas W. Cornelius, et al.. Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction. Workshop Correlative Materials Characterization, Oct 2022, Dresde, Germany. 2022. ⟨hal-03962880⟩
7 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More