Global electro-thermal modelling and circuit-type simulation of SiC Mosfet power devices in short-circuit operation for critical system analysis
Résumé
The purpose of this paper is to present, for the first time, a global transient electrothermal model and simulation results of commercially recent silicon carbide (SiC) power MOSFET devices. The developed models aim is faithfully transposing specifically experimental short-circuit (SC) behaviour of the studied components, ready-to-use for the analysis of an inverter-leg malfunctioning. After extensive experimentation, a thermal model of the SiC die allows to develop models of gate-leakage current and drain-source current during SC. After verifying the robustness of the proposed models, an original circuit-type with an easy implementation is performed using a commercial circuit simulation tool.
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