Journal Articles Current Opinion in Colloid & Interface Science Year : 2023

Atomic layer deposition: An efficient tool for corrosion protection

Abstract

Atomic layer deposition (ALD) is now a widely implemented thin film growing method. It is currently used in industrial fabrication processes of microelectronics and luminescent display technologies. Since compact and conformal films can be grown with a perfect control of the thickness, ALD is envisioned in numerous other applications fields such as energy, sensing, biomaterials and photonics. Although few reports can be found on its application to corrosion protection, it has been shown that qualities of ALD can be highly beneficial to this field. After a brief review of the principle of ALD and the effect of the main parameters on the properties of the films, this report attempts to show the interest of this technique to mitigate corrosion. Various examples of successful uses of ALD to protect metallic and non-metallic surfaces in different fields are reviewed.
Fichier principal
Vignette du fichier
ALD-Corr_v2-Hal.pdf (2.62 Mo) Télécharger le fichier
Origin Files produced by the author(s)

Dates and versions

hal-03935207 , version 1 (11-01-2023)

Identifiers

Cite

L. Santinacci. Atomic layer deposition: An efficient tool for corrosion protection. Current Opinion in Colloid & Interface Science, 2023, pp.101674. ⟨10.1016/j.cocis.2022.101674⟩. ⟨hal-03935207⟩
64 View
620 Download

Altmetric

Share

More