Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging - Archive ouverte HAL
Communication Dans Un Congrès Année : 2022
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hal-03910308 , version 1 (22-12-2022)

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  • HAL Id : hal-03910308 , version 1

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Juliano Borges, Maxime Darnon, Yann Beilliard, Dominique Drouin. Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging. AVS 68th International Symposium & Exhibition, Nov 2022, Pittsburgh, United States. ⟨hal-03910308⟩
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