A three-in-one ITO-Cu-ITO multilayer wire strategy is developed to reliably fabricate large-size backplane circuit for micro-LED display. The multilayered wire was prepared by magnetron sputtering and electroplating, and presented a sandwich structure of ITOtransitional layer /Cuseed layer /Cuelectroplating layer/ITOpassivation layer. Synergistic effect among the sandwiched layers endowed the coated wire with good electrical performance (2.31 × 10-3 Ω/sq), favorable adhesion (5B degree) and superior thickness uniformity (8 %), and could ensure reliable machining of glass-based backplane circuit. The fabricated multilayer wire facilitated the development of micro-LED backplane circuit, and was applicable to synthesize large-size (1.1 * 1.3 m2) glass backplane circuit. Field test of micro-LED circuit assembly proved the feasibility of the proposed backplane circuit strategy in production line. It is rational to believe that our strategy may offer a good avenue to upgrade traditional ITO and Cu materials for developing high-performance displays in scale production.