Realization of MEMS flush-mounted integration using Through Silicon Vias on thermal micro-sensors designed for aeronautics
A. Mazzamurro
(1, 2)
,
Cécile Ghouila-Houri
(1, 2)
,
T. Arnoult
,
Abdelkrim Talbi
(1, 2)
,
Philippe Pernod
(1, 2)
T. Arnoult
- Fonction : Auteur
Abdelkrim Talbi
- Fonction : Auteur
- PersonId : 748484
- IdHAL : abdelkrim-talbi
- ORCID : 0000-0002-7200-3636
- IdRef : 076947637
Philippe Pernod
- Fonction : Auteur
- PersonId : 744806
- IdHAL : philippe-pernod
- ORCID : 0000-0002-6708-8487
- IdRef : 061171646
Résumé
This paper reports the realization of Through Silicon Vias (TSV) filled with electrodeposited copper (Cu) for the fabrication of aeronautics dedicated thermal MEMS (Micro Electro-Mechanical Systems) sensors. The micro-sensors are designed to measure the skin friction of the airflow on a structure. For testing in real conditions on an aircraft, a solid integration is required. Therefore, a production batch was realized with TSV process developed and added to the sensor manufacturing process. The TSV process is composed of several steps including the realization of the metal membrane based electrode for the electrodeposition, deep silicon dry etching, copper filling and polishing. The sensors process followed the TSV process and the TSV equipped sensors chip were successfully fabricated. The electro-thermal characterizations of the TSV sensors chip demonstrated the same performances as the chips without TSV. Then, the micro-sensors were packaged allowing a flush-mounted integration on objects. A first test was done in wind tunnel before testing on flight.
Domaines
Sciences de l'ingénieur [physics]Format du dépôt | Notice |
---|---|
Type de dépôt | Communication dans un congrès |
Titre |
en
Realization of MEMS flush-mounted integration using Through Silicon Vias on thermal micro-sensors designed for aeronautics
|
Résumé |
en
This paper reports the realization of Through Silicon Vias (TSV) filled with electrodeposited copper (Cu) for the fabrication of aeronautics dedicated thermal MEMS (Micro Electro-Mechanical Systems) sensors. The micro-sensors are designed to measure the skin friction of the airflow on a structure. For testing in real conditions on an aircraft, a solid integration is required. Therefore, a production batch was realized with TSV process developed and added to the sensor manufacturing process. The TSV process is composed of several steps including the realization of the metal membrane based electrode for the electrodeposition, deep silicon dry etching, copper filling and polishing. The sensors process followed the TSV process and the TSV equipped sensors chip were successfully fabricated. The electro-thermal characterizations of the TSV sensors chip demonstrated the same performances as the chips without TSV. Then, the micro-sensors were packaged allowing a flush-mounted integration on objects. A first test was done in wind tunnel before testing on flight.
|
Auteur(s) |
A. Mazzamurro
1, 2
, Cécile Ghouila-Houri
1, 2
, T. Arnoult
, Abdelkrim Talbi
1, 2
, Philippe Pernod
1, 2
1
IEMN -
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
( 1066983 )
- [Univ. Lille, CNRS, Centrale Lille Institut, Junia, Univ. Polytechnique Hauts-de-France] ––
Laboratoire Central – Cité Scientifique – Avenue Poincaré – CS 60069 – 59652 VILLENEUVE D’ASCQ CEDEX
- France
2
AIMAN-FILMS - IEMN -
Acoustique Impulsionnelle & Magnéto-Acoustique Non linéaire - Fluides, Interfaces Liquides & Micro-Systèmes - IEMN
( 1066989 )
- Groupe AIMAN-FILMS (Magnéto-électriques, Electonique fonctionnelle, Acoustique, MEMS, Micro-fluidique) -
IEMN -
Université de Lille - Centrale Lille - Cité scientifique - BP48 - 59651 Villeneuve d'Ascq
- France
|
Langue du document |
Anglais
|
Vulgarisation |
Non
|
Comité de lecture |
Oui
|
Invité |
Non
|
Audience |
Internationale
|
Actes |
Oui
|
Page/Identifiant |
1-3
|
Titre du congrès |
2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
|
Date début congrès |
2022-07-11
|
Date fin congrès |
2022-07-13
|
Ville |
Pont-a-Mousson
|
Pays |
France
|
Domaine(s) |
|
Éditeur commercial |
|
Collaboration/Projet |
|
Référence interne |
|
Projet(s) ANR |
|
Financement |
|
Mots-clés |
en
MEMS sensors, Through Silicon Vias, Flow sensors
|
DOI | 10.1109/DTIP56576.2022.9911714 |
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