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Communication Dans Un Congrès Année : 2022

Self-healing encapsulation material for auto-repairable power module architectures

Résumé

A self-healing polymer intended to printed circuit boards (PCBs) insulation has been implemented. The applicability of this new material to PCB manufacturing and recovery of properties on mechanical and electrical standpoints are investigated. The research points to enhanced reliability for future architectures of integrated power modules.
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Dates et versions

hal-03859748 , version 1 (18-11-2022)
hal-03859748 , version 2 (10-02-2023)

Identifiants

  • HAL Id : hal-03859748 , version 2

Citer

Baptiste Arati, Vincent Bley, Julio Brandelero, Gilbert Teyssedre. Self-healing encapsulation material for auto-repairable power module architectures. 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Mar 2022, Berlin, Germany. pp. 132-137. ⟨hal-03859748v2⟩
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