Thermal analysis and shrinkage characterization of the photopolymers for DLP additive manufacturing processes - Archive ouverte HAL
Article Dans Une Revue Continuum Mechanics and Thermodynamics Année : 2022

Thermal analysis and shrinkage characterization of the photopolymers for DLP additive manufacturing processes

Résumé

This paper proposes an experimental investigation of a commercial photopolymer resin followed by material modelling and manufacturing system characterization. We focus on the effect of the degree of cure and temperature on the material properties of the photopolymer materials. UV curing properties of the liquid resin are assessed with the thickness measurement by optical tomography. Besides, the specific heat capacity is determined for the almost completely cured and uncured samples with DSC measurements. Photo-DSC experiments are performed to investigate the curing reaction and modelling of the evolution of the degree of cure depending on the light intensity and temperature. In addition, chemical shrinkage behaviour is captured as function of the degree of cure by the high-precision balance setup. As a result of our experimental studies, model equations are proposed to describe the material behaviour.
Fichier principal
Vignette du fichier
Sekmen_CMAT_2022.pdf (3.76 Mo) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-03854510 , version 1 (15-11-2022)

Identifiants

Citer

Kubra Sekmen, Thomas Rehbein, Michael Johlitz, Alexander Lion, Andrei Constantinescu. Thermal analysis and shrinkage characterization of the photopolymers for DLP additive manufacturing processes. Continuum Mechanics and Thermodynamics, 2022, ⟨10.1007/s00161-022-01137-0⟩. ⟨hal-03854510⟩
149 Consultations
383 Téléchargements

Altmetric

Partager

More