Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability - Archive ouverte HAL Accéder directement au contenu
Proceedings/Recueil Des Communications Année : 2021
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hal-03823340 , version 1 (20-10-2022)

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Chady Al Sayed, Omidreza Ghaffari, Yaser Nabavi Larimi, Francis Grenier, Simon Jasmin, et al.. Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability. 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), IEEE, pp.410-416, 2021, ⟨10.1109/ITherm51669.2021.9503279⟩. ⟨hal-03823340⟩
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