A novel integrated cooling packaging for high power density semiconductors - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2022

A novel integrated cooling packaging for high power density semiconductors

Résumé

This work investigates a packaging solution for high power density semiconductors (> 200 W/cm 2), allowing for a dramatic reduction in size and complexity of power electronics modules. The multiple layers in standard packaging structures degrade the cooling efficiency due as they lengthen the path between dies and heatsinks. Here, we reduce the layer count by merging the ceramic substrate and the heat exchanger in a single part. CFD simulations and experimental validation are performed on a single-chip cooling packaging, and demonstrate a 10-20 % reduction in thermal resistance over more traditional cooling solutions.
Fichier principal
Vignette du fichier
therminic_amin.pdf (8.77 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-03803773 , version 1 (06-10-2022)

Identifiants

Citer

Amin Salim Obaid Al-Hinaai, Till Huesgen, Cyril Buttay, Richard Zeitler, Daniela Mayer. A novel integrated cooling packaging for high power density semiconductors. 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland. ⟨10.1109/THERMINIC57263.2022.9950643⟩. ⟨hal-03803773⟩
65 Consultations
46 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More