Communication Dans Un Congrès Année : 2022

Packaging design for low EMI generation of power modules

Résumé

This paper investigates the impact of the design of a power module on its EMI generation, in the case of WBG components. Stray elements (inductances, capacitances) must be carefully reduced or designed, but that's not all: shielding effect and integrated filtering are also investigated. It results in some design rules for packaging. Some examples of power modules design will be presented

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Dates et versions

hal-03795727 , version 1 (04-10-2022)

Identifiants

  • HAL Id : hal-03795727 , version 1

Citer

Pierre-Olivier Jeannin, Jean-Luc Schanen. Packaging design for low EMI generation of power modules. International Workshop on Integrated Power Packaging (IWIPP) 2022, Aug 2022, GRENOBLE, France. ⟨hal-03795727⟩
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