A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics
Résumé
This work investigates a packaging solution for high voltage semiconductors (20 kV), allowing for a dramatic reduction in size and complexity of power electronics modules. The standard packaging structures typically introduce a competition between electrical insulation (which requires thick insulating layers) and thermal performance (where thin, high thermal conductivity layers are preferred). Here, we introduce a concept which addresses this competition and is based on direct cooling using dielectric liquid. Single-chip heatsinks are designed, optimized using computational fluid dynamics (CFD), built and tested.
Domaines
Energie électrique
Fichier principal
Amin_s_IWIPP_paper.pdf (7.53 Mo)
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IWIPP_Presentation-Amin.pdf (4.18 Mo)
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