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Communication Dans Un Congrès Année : 2022

A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics

Cyril Buttay
Eric Vagnon
Richard Zeitler
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Daniela Meyer
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Résumé

This work investigates a packaging solution for high voltage semiconductors (20 kV), allowing for a dramatic reduction in size and complexity of power electronics modules. The standard packaging structures typically introduce a competition between electrical insulation (which requires thick insulating layers) and thermal performance (where thin, high thermal conductivity layers are preferred). Here, we introduce a concept which addresses this competition and is based on direct cooling using dielectric liquid. Single-chip heatsinks are designed, optimized using computational fluid dynamics (CFD), built and tested.
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Dates et versions

hal-03772005 , version 1 (07-09-2022)

Identifiants

Citer

Amin Salim Obaid Al-Hinaai, Till Huesgen, Cyril Buttay, Eric Vagnon, Richard Zeitler, et al.. A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩. ⟨hal-03772005⟩
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