Increasing the reliability of DFB lasers on glass: the approach of encapsulation by wafer bonding - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2022

Increasing the reliability of DFB lasers on glass: the approach of encapsulation by wafer bonding

Fichier non déposé

Dates et versions

hal-03694523 , version 1 (13-06-2022)

Identifiants

Citer

Léo Hetier, Lionel Bastard, Jean-Emmanuel Broquin, Julien Poëtte. Increasing the reliability of DFB lasers on glass: the approach of encapsulation by wafer bonding. Integrated Optics: Devices, Materials, and Technologies XXVI, Jan 2022, San Francisco, United States. pp.22, ⟨10.1117/12.2608815⟩. ⟨hal-03694523⟩
17 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More