Impact of Thermal Cycling Frequency on IGBT Power Module Lifetime - Archive ouverte HAL
Communication Dans Un Congrès Année : 2022

Impact of Thermal Cycling Frequency on IGBT Power Module Lifetime

Résumé

The paper presents the impact of thermal cycling frequency on the lifetime of IGBT power module. The first part will be devoted to a quick presentation of the test bench. Then, the test protocols will be detailed as well as the measurement protocol to characterise the ageing of the power module wirebonds. An important part will be devoted to the results of ageing. Before concluding, mechanical tensile tests on bondwires will complete the ageing tests.
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Dates et versions

hal-03668732 , version 1 (16-05-2022)

Identifiants

Citer

Guillaume Pellecuer, Jean-Jacques Huselstein, Thierry Martiré, François Forest, André Chrysochoos, et al.. Impact of Thermal Cycling Frequency on IGBT Power Module Lifetime. PCIM Europe 2022, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2022, Nuremberg, Germany. ⟨10.30420/565822120⟩. ⟨hal-03668732⟩
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