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Communication Dans Un Congrès Année : 2022
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hal-03666406 , version 1 (12-05-2022)

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Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat. Epoxy Mold Compound Characterization for Modeling Packaging Reliability. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, France. pp.1-5, ⟨10.1109/EuroSimE54907.2022.9758842⟩. ⟨hal-03666406⟩
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