A large range of commercial deep submicron VLSI devices are used for avionic designs. Due to the scaling down, an ever higher level of integration and the use of new materials in foundries, the main failure mechanisms are changing while new ones appear. Lifetimes related to these failure mechanisms are suspected of being shorter and shorter so failure rate prediction becomes a great challenge for deep submicron (DSM) semiconductor reliability. We propose in this paper, a new approach based on technologies analysis in order to determine potential reliability risks regarding the specific use of DSM components for avionic applications.