Reliability aspects of gate oxide under ESD pulse stress - Archive ouverte HAL
Article Dans Une Revue Microelectronics Reliability Année : 2009

Reliability aspects of gate oxide under ESD pulse stress

Résumé

Power law time-to-breakdown voltage acceleration is investigated down to ultra-thin oxides (1.1 nm) in the ESD regime in inversion and accumulation. Breakdown modes, oxide degradation and device drifts under ESD-like stress are discussed as function of the oxide thickness. The consequent impacts on the ESD design window are presented.
Fichier non déposé

Dates et versions

hal-03655114 , version 1 (29-04-2022)

Identifiants

Citer

Adrien Ille, Wolfgang Stadler, Thomas Pompl, Harald Gossner, Tilo Brodbeck, et al.. Reliability aspects of gate oxide under ESD pulse stress. Microelectronics Reliability, 2009, Microelectronics Reliability, 49 (12), pp.1407-1416. ⟨10.1109/EOSESD.2007.4401771⟩. ⟨hal-03655114⟩
16 Consultations
0 Téléchargements

Altmetric

Partager

More