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Article Dans Une Revue Microelectronics Reliability Année : 2013

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

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hal-03577706 , version 1 (16-02-2022)

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Didier Chicot, K. Tilkin, K. Jankowski, A. Wymysłowski. Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. Microelectronics Reliability, 2013, 53 (5), pp.761-766. ⟨10.1016/j.microrel.2013.01.008⟩. ⟨hal-03577706⟩
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