In Accumulated Low Schottky Barrier metal oxide semiconductor field effect transistors (MOSFET) on SOl structures, very thin silicide layers are used for ohmic contacts. Silicide contacts form due to metallurgical reaction of metal with semiconductor. In order to get a broad vision of the most interesting metal/silicide solution several material stacks were evaluated including platinum and iridium. In this work cross-sectional transmission electron microscopy was used to study the process of silicide formation in metal/Si and metal/SiGe/Si structures. Novel structure architectures have been developed. They are mainly based on the use of a very thin film SOl substrate with typical active silicon layer thicknesses ranging between 2 and 20 nm for 10-40 nm gate length MOSFETs. In Accumulation LowSchottky Barrier -SOI MOSFET structures very thin silicides are used for ohmic contacts. Silicide contacts form due to metallurgical reaction of metal with semiconductor.