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Communication Dans Un Congrès Année : 2021

Plastic Microwave Fibers at Millimeter-wave and THz Frequencies as a Low Cost Data Link

Résumé

A chip-to-chip, board-to-board or module-to-module interconnect is presented that offers over 100 Gbit/s datarates at a cost of a few cents per link based on polymer microwave fiber technology. The link uses a PTFE core with air cladding, connected using plastic metal-waveguide flanges. This work demonstrates that dielectric waveguides could become a key technology in enabling faster communication technology and chip-to-chip interconnects. Using OOK, QPSK and QAM16, data rates of 24 Gbit/s, 64 Gbit/s and 128 Gbit/s respectively were reached.
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Dates et versions

hal-03540988 , version 1 (24-01-2022)

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Citer

Joren Vaes, Kristof Dens, Guillaume Ducournau, Patrick Reynaert. Plastic Microwave Fibers at Millimeter-wave and THz Frequencies as a Low Cost Data Link. 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021, Jun 2021, Atlanta, United States. pp.589-591, ⟨10.1109/IMS19712.2021.9574897⟩. ⟨hal-03540988⟩
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