Full-Field Displacement Measurement within a Metal-as-Insulation HTS Pancake
Résumé
In situ measurement of metal-as-insulation (MI) high temperature superconductor (HTS) pancake magnet deformation gives insight to its actual mechanical state. Measurement of hoop strain for inner / outer turn of MI pancake is possible locally using strain gauges. Hence, to avoid this local measurement limit, non-contact full-field displacement measurement is adopted. This technique is based on digital image correlation (DIC), which derives the displacement field in specified region of interest (ROI) by correlation between the deformed state image and the reference state image.
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