V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue IEEE Microwave and Wireless Components Letters Année : 2015

V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology

Résumé

In this letter, a grounded coplanar waveguide-to-microstrip (GCPW-to-MS) transition without via holes is presented. The transition is designed on a PET® substrate and fabricated using inkjet printing technology. To our knowledge, fabrication of transitions using inkjet printing technology has not been reported in the literature. The simulations have been performed using HFSS® software and the measurements have been carried out using a Vector Network Analyzer on a broad frequency band from 40 to 85 GHz. The effect of varying several geometrical parameters of the GCPW-to-MS on the electromagnetic response is also presented. The results obtained demonstrate good characteristics of the insertion loss better than 1.5 dB, and return loss larger than 10 dB in the V-band (50-75 GHz). Such transitions are suitable for characterization of microwave components built on different flexible substrates. © 2015 IEEE.
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hal-03538488 , version 1 (21-01-2022)

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A. Chahadih, Pierre-Yves Cresson, C. Mismer, T. Lasri. V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology. IEEE Microwave and Wireless Components Letters, 2015, 25 (7), pp.436-438. ⟨10.1109/LMWC.2015.2427576⟩. ⟨hal-03538488⟩
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