A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements - Archive ouverte HAL
Article Dans Une Revue Journal of Micromechanics and Microengineering Année : 2022

A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements

Résumé

Miniaturized, microfabricated microelectromechanical systems (MEMS)-based wafer probes are used here to evaluate different contact pad metallization at low tip forces (1000 Nm-1) and small contact pads enabled us to show that it is the length of the pad (in contact with the surface) which determines the contact resistivity rather than the total contact pad area.
Fichier principal
Vignette du fichier
Arscott_JMM_2022 (1).pdf (2.86 Mo) Télécharger le fichier
Origine Fichiers éditeurs autorisés sur une archive ouverte

Dates et versions

hal-03449369 , version 1 (29-11-2022)

Identifiants

Citer

Khadim Daffe, Jaouad Marzouk, Christophe Boyaval, Gilles Dambrine, Kamel Haddadi, et al.. A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements. Journal of Micromechanics and Microengineering, 2022, 32 (1), pp.015007. ⟨10.1088/1361-6439/ac3cd7⟩. ⟨hal-03449369⟩
82 Consultations
274 Téléchargements

Altmetric

Partager

More