Communication Dans Un Congrès Année : 2021

Opportunities and challenges brought by 3D-sequential integration

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hal-03434018 , version 1 (18-11-2021)

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Christoforos Theodorou, P. Batude, L. Brunet, C. Fenouillet-Beranger, D. Lattard, et al.. Opportunities and challenges brought by 3D-sequential integration. 2021 IEEE International Interconnect Technology Conference (IITC), Jul 2021, Kyoto, France. pp.1-1, ⟨10.1109/IITC51362.2021.9537356⟩. ⟨hal-03434018⟩
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