Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2020
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hal-03380517 , version 1 (15-10-2021)

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Said Bensebaa, Mounira Bouarroudj-Berkani, Stéphane Lefebvre, Mickael Petit, N. Schmitt. Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam. 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩. ⟨hal-03380517⟩
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