Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2021
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hal-03336972 , version 1 (07-09-2021)

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E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, et al.. Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling. 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), Jun 2021, San Diego, United States. pp.2293-2301, ⟨10.1109/ECTC32696.2021.00359⟩. ⟨hal-03336972⟩
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