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Communication Dans Un Congrès Année : 2015

Application-oriented performance of RF CMOS technologies on flexible substrates

Résumé

Ultimate-thinning-and-transfer-bonding (UTTB) of RF SOI-CMOS chips is demonstrated on plastic, metal and glass substrates. Beyond process simplicity, UTTB can be tailored to meet specific application requirements like ultra mechanical flexibility, heat dissipation, transparency while retaining same f(T)/f(max) performance and improving harmonic rejection when compared to conventional rigid SOI.
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Dates et versions

hal-03272696 , version 1 (28-06-2021)

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Justine Philippe, Aurélien Lecavelier, Matthieu Berthomé, J.F. Robillard, Christophe Gaquière, et al.. Application-oriented performance of RF CMOS technologies on flexible substrates. IEEE International Electron Devices Meeting (IEDM), Dec 2015, Washington, United States. ⟨10.1109/IEDM.2015.7409707⟩. ⟨hal-03272696⟩
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