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Communication Dans Un Congrès Année : 2021

Components and packaging based on polymer for future automotive applications

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Electronique
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Dates et versions

hal-03194659 , version 1 (09-04-2021)

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  • HAL Id : hal-03194659 , version 1

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Yves Ousten, Isabelle Bord Majek. Components and packaging based on polymer for future automotive applications. SIA SFIP Materials for Future Mobility 2021, Feb 2021, Bordeaux (Digital Edition), France. ⟨hal-03194659⟩
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