AlGaN channel high electron mobility transistors with regrown ohmic contacts
Idriss Abid
(1)
,
Jash Mehta
(1)
,
Yvon Cordier
(2)
,
Joff Derluyn
(3)
,
Stefan Degroote
(3)
,
Hideto Miyake
,
F Medjdoub
(1, 4)
Idriss Abid
- Fonction : Auteur
- PersonId : 1135189
- IdHAL : idriss-abid
- ORCID : 0000-0001-5134-4952
Jash Mehta
- Fonction : Auteur
- PersonId : 752973
- IdHAL : jash-mehta
- ORCID : 0000-0002-4278-6596
Yvon Cordier
- Fonction : Auteur
- PersonId : 750365
- IdHAL : yvon-cordier
- ORCID : 0000-0003-3720-9409
- IdRef : 128170794
Hideto Miyake
- Fonction : Auteur
- PersonId : 958265
F Medjdoub
- Fonction : Auteur
- PersonId : 740399
- IdHAL : faridmedjdoub
- ORCID : 0000-0002-4753-4718
- IdRef : 084651512
Résumé
High power electronics using wide bandgap materials are maturing rapidly, and significantmarket growth is expected in a near future. Ultra wide bandgap materials, which have an even largerbandgap than GaN (3.4 eV), represent an attractive choice of materials to further push the performancelimits of power devices. In this work, we report on the fabrication of AlN/AlGaN/AlN high-electronmobility transistors (HEMTs) using 50% Al-content on the AlGaN channel, which has a much widerbandgap than the commonly used GaN channel. The structure was grown by metalorganic chemicalvapor deposition (MOCVD) on AlN/sapphire templates. A buffer breakdown field as high as5.5 MV/cm was reported for short contact distances. Furthermore, transistors have been successfullyfabricated on this heterostructure, with low leakage current and low on-resistance. A remarkablethree-terminal breakdown voltage above 4 kV with an off-state leakage current below 1μA/mm wasachieved. A regrown ohmic contact was used to reduce the source/drain ohmic contact resistance,yielding a drain current density of about 0.1
Domaines
Sciences de l'ingénieur [physics]Format du dépôt | Fichier |
---|---|
Type de dépôt | Article dans une revue |
Titre |
en
AlGaN channel high electron mobility transistors with regrown ohmic contacts
|
Résumé |
en
High power electronics using wide bandgap materials are maturing rapidly, and significantmarket growth is expected in a near future. Ultra wide bandgap materials, which have an even largerbandgap than GaN (3.4 eV), represent an attractive choice of materials to further push the performancelimits of power devices. In this work, we report on the fabrication of AlN/AlGaN/AlN high-electronmobility transistors (HEMTs) using 50% Al-content on the AlGaN channel, which has a much widerbandgap than the commonly used GaN channel. The structure was grown by metalorganic chemicalvapor deposition (MOCVD) on AlN/sapphire templates. A buffer breakdown field as high as5.5 MV/cm was reported for short contact distances. Furthermore, transistors have been successfullyfabricated on this heterostructure, with low leakage current and low on-resistance. A remarkablethree-terminal breakdown voltage above 4 kV with an off-state leakage current below 1μA/mm wasachieved. A regrown ohmic contact was used to reduce the source/drain ohmic contact resistance,yielding a drain current density of about 0.1
|
Auteur(s) |
Idriss Abid
1
, Jash Mehta
1
, Yvon Cordier
2
, Joff Derluyn
3
, Stefan Degroote
3
, Hideto Miyake
, F Medjdoub
1, 4
1
IEMN -
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
( 1066983 )
- [Univ. Lille, CNRS, Centrale Lille Institut, Junia, Univ. Polytechnique Hauts-de-France] ––
Laboratoire Central – Cité Scientifique – Avenue Poincaré – CS 60069 – 59652 VILLENEUVE D’ASCQ CEDEX
- France
2
CRHEA -
Centre de recherche sur l'hétéroepitaxie et ses applications
( 409 )
- Bat. 5 Rue Bernard Grégory 06560 VALBONNE
- France
3
SOITEC
( 58497 )
- France
4
WIND - IEMN -
WIde baNd gap materials and Devices - IEMN
( 1079230 )
- France
|
Date de publication électronique |
2021-03-10
|
Volume |
10
|
Numéro |
6
|
Page/Identifiant |
635
|
Licence |
Paternité
|
Nom de la revue |
|
Langue du document |
Anglais
|
Vulgarisation |
Non
|
Comité de lecture |
Oui
|
Audience |
Internationale
|
Date de publication |
2021-03-10
|
Financement |
|
Référence interne |
|
Projet(s) ANR |
|
Projet(s) Européen(s) |
|
Domaine(s) |
|
Collaboration/Projet |
|
Mots-clés |
en
Ultra-wide BandGap, HEMTs transistors
|
DOI | 10.3390/electronics10060635 |
Origine :
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