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Communication Dans Un Congrès Année : 2020

Full 3D advanced packaging concepts for Wide Bandgap Power Electronics

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hal-03051992 , version 1 (10-12-2020)

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  • HAL Id : hal-03051992 , version 1

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Jean-Luc Schanen, Yvan Avenas, Pierre-Olivier Jeannin. Full 3D advanced packaging concepts for Wide Bandgap Power Electronics. APEC 2020 – Industry session, Mar 2020, New Orleans, Louisiana, United States. ⟨hal-03051992⟩
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