Heterogenous Bump Metallurgy Through a Sequential Plating Based Process - Archive ouverte HAL Accéder directement au contenu
Proceedings/Recueil Des Communications Année : 2020
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hal-02919186 , version 1 (21-08-2020)

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A. El Amrani, E. Paradis, D. Danovitch, D. Drouin. Heterogenous Bump Metallurgy Through a Sequential Plating Based Process. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), IEEE, pp.702-709, 2020, ⟨10.1109/ECTC32862.2020.00116⟩. ⟨hal-02919186⟩
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