3D Haptic Handling of Microspheres - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2010

3D Haptic Handling of Microspheres

Résumé

In this paper, a fully teleoperated 3D micro assembly task with haptic feedback is presented. Microspheres (diameter: 4 − 6µm) are manipulated by pick-and-place. The setup is composed of a dual-tip gripper controlled through a haptic interface. To grasp the spheres, the tips must be correctly positioned with respect to the objects. The approach proposed to align the gripper is based on a user-driven exploration of the to-be-manipulated object. During this step, the haptic feedback is based on amplitude measurements from cantilevers in dynamic mode. Hence, the operator perceives the contact while freely exploring the manipulation area. A virtual guide is generated to pull the user to the optimum contact point, allowing correct positioning of dual tips. For the pick-and-place operation, the haptic feedback provides the user with information about the microscale interactions occurring during the operation. As experimental validation, a two-layer pyramid composed of four nylon microspheres is built in ambient conditions.
Fichier principal
Vignette du fichier
iros10.pdf (1.12 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-02912199 , version 1 (05-08-2020)

Identifiants

Citer

Aude Bolopion, Hui Xie, Sinan Haliyo, Stéphane Régnier. 3D Haptic Handling of Microspheres. 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2010), Oct 2010, Taipei, Taiwan. pp.6131-6136, ⟨10.1109/IROS.2010.5650443⟩. ⟨hal-02912199⟩
17 Consultations
63 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More