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Journal Articles IEEE/ASME Transactions on Mechatronics Year : 2012

Haptic Teleoperation for 3-D Microassembly of Spherical Objects


In this paper, teleoperated 3D microassembly of spherical objects with haptic feedback is presented. A dual-tip gripper controlled through a haptic interface is used to pick-and-place microspheres (diameter: 4 − 6µm). The proposed approach to align the gripper with the spheres is based on a user-driven exploration of the object to be manipulated. The haptic feedback is based on amplitude measurements from cantilevers in dynamic mode. That is, the operator perceives the contact while freely exploring the manipulation area. The data recorded during this exploration are processed online and generate a virtual guide to pull the user to the optimum contact point, allowing correct positioning of the dual tips. A preliminary scan is not necessary to compute the haptic feedback, which increases the intuitiveness of our system. For the pick-and-place operation, two haptic feedback schemes are proposed to either provide users with information about microscale interactions occurring during the operation, or to assist them while performing the task. As experimental validation, a two-layer pyramid composed of four microspheres is built in ambient conditions.
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hal-02912159 , version 1 (05-08-2020)



Aude Bolopion, Hui Xie, Sinan Haliyo, Stéphane Régnier. Haptic Teleoperation for 3-D Microassembly of Spherical Objects. IEEE/ASME Transactions on Mechatronics, 2012, 17 (1), pp.116-127. ⟨10.1109/TMECH.2010.2090892⟩. ⟨hal-02912159⟩
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