Despite recent successes in three-dimensional ultrafast laser writing inside silicon and other narrow gap materials, strong discrepancies remain in the identified narrow experimental windows to exceed material breakdown thresholds. In an experiment in which we irradiate silicon with perfectly synchronized femtosecond, picosecond, and nanosecond pulses, we show that the temporal contrast of the ultrashort pulses is a critical driving parameter, even more than the achievable peak vacuum intensity. We identify by appropriate pulse combinations breakdown channels seeded by pre-ionization and thermal runaway from the simulated contrast imperfections. The introduction of this multi-timescale control of the interactions allows bulk writing inaccessible otherwise. It also permits a comprehensive review of previous reports using infrared laser technologies at different characteristic contrast performances. The quantitative analysis of the problem reveals an extremely high sensitivity with modification ignition at intensity contrasts down to 10 −6 and below. This sensitivity level is common for high-intensity physics experiments but has no equivalent in any other laser material processing application.