This special issue of Microelectronics and Reliability is devoted to the publication of the papers presented during the 30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2019, in Toulouse (France) from September 23th to September 26th, 2019. This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro-, nano-, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications. For this 30th edition, in addition to the core topics of the conference, we involved the major actors of aeronautics, space and embedded systems industry to provide specific topics such as radiation hardening, very long-term reliability, high/low temperature challenges, obsolescence and counterfeit issues, wide bandgap power devices for the more electric aircraft and other embedded system applications. A special session for space and aeronautic systems is proposed.