Creep characterization of refractory materials at high temperatures using the Integrated Digital Image Correlation - Archive ouverte HAL
Conference Papers Year : 2019

Creep characterization of refractory materials at high temperatures using the Integrated Digital Image Correlation

Lucas Breder Teixeira
  • Function : Author
  • PersonId : 1217300
  • IdRef : 267132360
Mécanique des Matériaux et Procédés
Jean Gillibert
Mécanique des Matériaux et Procédés
Eric Blond
Mécanique des Matériaux et Procédés
CV
Thomas Sayet
Mécanique des Matériaux et Procédés
CV

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Mechanical engineering [physics.class-ph]

Lucas BREDER TEIXEIRA  : Connect in order to contact the contributor

https://hal.science/hal-02612013

Submitted on : Monday, May 18, 2020-6:45:32 PM

Last modification on : Wednesday, September 11, 2024-2:10:03 PM

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hal-02612013 , version 1 (18-05-2020)

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  • HAL Id : hal-02612013 , version 1

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Lucas Breder Teixeira, Jean Gillibert, Eric Blond, Thomas Sayet. Creep characterization of refractory materials at high temperatures using the Integrated Digital Image Correlation. United International Technical Conference of Refractories, Oct 2019, Yokohama, Japan. ⟨hal-02612013⟩

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