Double side interconnection for vertical power components based on macro and nano structured copper interfaces and printed circuit board technologies
Résumé
This paper describes a full copper Z-axis interconnection manufacturing for vertical power electronic components. The approach is a combination of a die embedding in a PCB and interconnections by macro post overlaid with nano wires, ensuring both electrical and thermal connection of the die.
Origine | Fichiers produits par l'(les) auteur(s) |
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