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Article Dans Une Revue Microelectronics Reliability Année : 2018

Sequential combined thermal cycling and vibration test and simulation of printed circuit board

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hal-02516781 , version 1 (24-03-2020)

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  • HAL Id : hal-02516781 , version 1

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Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage. Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectronics Reliability, 2018. ⟨hal-02516781⟩
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