Laser-Induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations - Archive ouverte HAL Accéder directement au contenu
Proceedings/Recueil Des Communications Année : 2019

Laser-Induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations

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hal-02453570 , version 1 (23-01-2020)

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Gul Zeb, David Danovitch, Eric Turcotte. Laser-Induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), May 2019, Las Vegas, United States. IEEE, pp.467-473, 2019, ⟨10.1109/ECTC.2019.00077⟩. ⟨hal-02453570⟩
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