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Communication Dans Un Congrès Année : 2007

Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration

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hal-02440162 , version 1 (15-01-2020)

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Alain Phommahaxay, Gaelle Bazin Lissorgues, Lionel Rousseau, Vincent Perrais, Tarik Bourouina, et al.. Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration. Transducers 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, Jun 2007, Lyon, France. pp.2063-2066, ⟨10.1109/SENSOR.2007.4300570⟩. ⟨hal-02440162⟩
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