REVaMP 2 Project: Towards Round-Trip Engineering of Software Product Lines -Approach, Intermediate Results and Challenges - Archive ouverte HAL Access content directly
Conference Papers Year : 2019

REVaMP 2 Project: Towards Round-Trip Engineering of Software Product Lines -Approach, Intermediate Results and Challenges

Andrey Sadovykh
Tewfik Ziadi
Alessandra Bagnato
  • Function : Author
  • PersonId : 975445
Thorsten Berger
  • Function : Author
  • PersonId : 1062116
  • IdRef : 271026782
Raúl Mazo
Elena Gallego
  • Function : Author

Abstract

The REVaMP 2 Project is a major European effort towards Round-Trip Engineering of Software Product Lines for software intensive systems. Indeed, software is predominant in almost every modern industry. The importance of time-to-market has grown tremendously in many business domains. Organizations are in a constant search for approaches for mass production of highly customizable systems. The software product lines engineering approach promises to provide up to 10x speed increase benefits in time-to-market. Traditionally, automated tools proposed a top-down approach, i.e., variants were generated from a model of the product line. However, the industry used a bottom-up approach that helped to recreate a product line out of various clones of a system. This operation is very costly and error prone. The goal of REVaMP 2 is to automate the process of extracting a product line from various system artifacts and help with verification and the co-evolution of the product line. The project involves 27 partners that contribute with diverse research and industrial practices to address case study challenges stemming from 11 application domains. In this paper, we would like to present the motivation for the project, the current approach, the intermediate results and challenges.
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Dates and versions

hal-02428581 , version 1 (06-01-2020)

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Andrey Sadovykh, Tewfik Ziadi, Alessandra Bagnato, Thorsten Berger, Jan-Philipp Steghöfer, et al.. REVaMP 2 Project: Towards Round-Trip Engineering of Software Product Lines -Approach, Intermediate Results and Challenges. International Conference on Objects, Components, Models and Patterns (TOOLS 2019), Oct 2019, Innopolis, Russia. pp.406-417, ⟨10.1007/978-3-030-29852-4_34⟩. ⟨hal-02428581⟩
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