Non-destructive techniques for evaluating the reliability of high frequency active devices - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Microelectronics Reliability Année : 2019

Non-destructive techniques for evaluating the reliability of high frequency active devices

Résumé

SiGe and GaN technologies have achieved rapid development over the last two decades. High level of RF circuit integration on Si low cost substrates open the way for large development of SiGe HBTs, while needs for high power density make GaN HEMT a key technology for solid state power modules. As both of these technologies achieve very elevated frequencies, they become strong contenders to GaAs technologies. Then reliability studies are needed to improve the process at the lower technology readiness level scale, and to stabilize the technological process till the final qualification step. To make an efficient diagnostic on the causal origin of the physical root mechanisms involved during the application of a stress, a multi-tool approach is mandatory to secure the diagnostic. In this paper, case studies on SiGe HBT and GaN HEMT stressed devices are proposed through the cross-analysis of low frequency noise spectral densities, of electrical transient measurements, and of TCAD simulations.
Fichier principal
Vignette du fichier
ESREF_2019_InvitedPaper_Tartarin_20JuneFINAL.pdf (1.52 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-02388674 , version 1 (02-12-2019)

Identifiants

Citer

Jean-Guy Tartarin. Non-destructive techniques for evaluating the reliability of high frequency active devices. Microelectronics Reliability, 2019, 100-101, pp.113359. ⟨10.1016/j.microrel.2019.06.051⟩. ⟨hal-02388674⟩
56 Consultations
153 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More