Hybrid 3D integrated circuit at millimeter-wave frequencies: advantages and trends
Résumé
The implementation of passive rf functions is usually done by means of coplanar waveguides at mm-wave frequencies. We propose original solutions for improving their reliability, by integrating the parasitic mode filters as dielectric bridges through a 3D integration approach. Furthermore, original compensating methods are proposed in order to control the cut-off frequencies induced by the bounding networks.
The 3D hybrid approach can also be efficiently used so as to accommodate the association between active, passive and radiating components. The 3D-CPW technology is therefore completed with Thin Film MicroStrip configurations (tfms), while composite ceramic/foam architectures become thinkable for radiating arrays.
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