High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films - Archive ouverte HAL
Article Dans Une Revue Micro and Nano Engineering Année : 2018

High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films

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Micro et nanotechnologies/Microélectronique

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https://hal.science/hal-02267745

Soumis le : lundi 19 août 2019-16:56:15

Dernière modification le : mardi 4 juin 2024-11:28:03

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hal-02267745 , version 1 (19-08-2019)

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Mukesh Kulsreshath, Alexane Vital, Philippe Lefaucheux, Christophe Sinturel, Thomas Tillocher, et al.. High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films. Micro and Nano Engineering, 2018, 1, pp.42-48. ⟨10.1016/j.mne.2018.10.007⟩. ⟨hal-02267745⟩

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