Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue IEEE Transactions on Components Packaging and Manufacturing Technology Part B Année : 2015

Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate

Résumé

The dependence of self-inductance and mutual inductance on bonding wire (BW) geometric profile has been studied in several papers. This paper will present a method using a BW-geometric-profile-dependent term to include this dependence in a simple model of BWs. The model element values will be calculated only from geometric dimensions. An experimental structure of two BWs in parallel planes has been fabricated based upon glass substrate technique for verification. A good agreement was obtained up to 8 GHz in comparison to electromagnetic simulation and measurement.
Fichier non déposé

Dates et versions

hal-02190867 , version 1 (23-07-2019)

Identifiants

Citer

Thanh Vinh Dinh, Julien Pagazani, Dominique Lesenechal, Daniel Pasquet, Philippe Descamps, et al.. Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate. IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩. ⟨hal-02190867⟩
55 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More