This work takes place in the general context of a better understanding of materials degradation mechanisms in extreme environments. In particular, the aim of the present study was to correlate microstructural elements to growth stress magnitude evolution and stress release mechanisms for thermally grown chromia thin films on NiCr alloys. Strains in thermally grown oxides have been measured in-situ, as the oxides develop and evolve. Data have been acquired from oxides grown for different high temperatures evolutions on NiCr model alloys that form Cr2O3. Using synchrotron X-Ray at the ESRF (Beamline BM02) coupled with an induction furnace, Debye-Scherrer diffraction patterns from the oxidizing specimen were recorded in air at temperature between 700-1000°C and during cooling. The distortion of the diffraction rings was analyzed to yield the in-plane strain. Thermal stresses imposed on Cr2O3/NiCr by abruptly reducing the sample temperature for a period of time, exploiting the thermal expansion difference between oxide and substrate, showed noticeable subsequent stress relaxation by creep. Such a mechanism was monitored using time-dependent in situ measurements of strain relaxation in the oxide. The main results obtained from these experiments are the kinetic of the growth stress from the isothermal measurements (isothermal plateau), and the study of the stress release mechanism after the low-temperature jumps. In complement, the oxide microstructure development during the course of oxidation is also investigated from both the peaks intensity and width evolution. In all cases, the steady stage growth strain was relatively low and compressive. Different degrees of relaxation were also found on cooling depending on scale microstructure through the variation of the initial oxidation conditions. Results are compared with other reports of residual stresses evolution in Cr2O3 scales. © 2017 Trans Tech Publications, Switzerland.